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Release Time:2020-01-03 Edit the author:电子you戏ting下载 Reading:2274

检测huan境:

1、检测huan境:溫度:25+/-3℃,湿度:40-70%RH 

2.zai距40W日光灯(huo等xiao光源)1m之内,被检距检yan员30cm之处进行外型判定 

chou样水准 

QAchou样标准:执行GB/T2828.1-2003IIji正常检测一次chou样fang案 AQLzhi:CR:0MAJ:0.25MIN:0.65 

检测she备 

塞尺、fang大镜、BOM清dan、贴片fang位图SMT外型检测标准

检测xiang目: 

1,锡珠:

焊锡球违反最xiao电气she备间隙。焊锡球wei固定zai免清除的瞲ing趆uo覆盖zai保形浸涂下。焊锡球的直径≤0.13mm可yunshou,反之,拒shou。2,假焊:

元件可焊端与PAD间的重叠一部分(J)清楚可见。元件末端与PAD间的重叠一部分不足(拒shou) 

3,侧立:

总宽(W)对gao度(H)的占比不超guo二比一(yunshou)总宽(W)对gao度(H)的占比超guo二比一,元件可焊端与PAD表mianweiwan全溶胀。元件大于1206类。

4,立碑:

片式元件末端qiao起

5,bian平、L形和翼形脚位偏移:最大侧mian偏移(A)不大于脚位总宽(W)的50%huo0.5mm(0.02英寸)最大侧mian偏移(A)大于脚位总宽(W)的50%huo0.5mm(0.02英寸)

6,圆柱ti端帽可焊端侧mian偏移:侧mian偏移(A)≤元件直径总宽(W)huoPAD总宽(P)的25%侧mian偏移(A)大于元件直径总宽(W)huoPAD总宽(P)的25%

7,片式元件-ju形huofang形可焊端元件侧mian偏移:侧mian偏移(A)≤元件可焊端总宽(W)的50%huoPAD总宽(P)的50%。侧mian偏移(A)大于元件可焊端总宽(W)的50%huoPAD总宽(P)的50%

8,J形脚位侧mian偏移:侧mian偏移(A)xiao于huo等于脚位总宽(W)的50%。侧mian偏移(A)超guo脚位总宽(W)的50%

连锡:元件脚位与PAD焊jie整qi,无偏移短路的现象。焊锡联jie不应该联jie的导线。焊锡zai毗邻的不tong导线huo元件间形成桥jie

9,反向: 元件上的极衴uan悖ò咨縴in)与PCB二极管丝yinfang位一致元件上极衴uan悖ò咨縴in)与PCBshe计上二极管的丝yin不一致。

10,锡量guoduo:最大gao度焊点(E)可yi超出PADhuo延shen至可焊端的端帽金属du层顶端,dan不可延shen至元件ti焊锡已延shen至元件ti顶端。

11,反白:you暴lu存积电气材质的片式元件将材质lian朝离yinzhimian贴片Chip零件每Pcs板zhiyun许一个≤0402的元件反白。you暴lu存积电气材质的,片式元件将材质mian朝向yinzhimian贴片Chip零件每Pcs板不yun许两个huo两个yi上≤0402的元件反白。12,空焊:元件脚位与PAD之间电焊焊jie点良湿润饱man,元件脚位无qiao起元件脚位排lie不整qi(共mian),妨碍可jie受电焊焊jie的形成。

13,冷焊:回流guo程锡gaowan全延shen,电焊焊jie点上的锡wan全湿润且表mian光泽。焊锡球上的焊锡gao回流不wan全,锡的外观展现暗色ji不gui则,锡gaoyouweiwan全熔解的锡fen。

14,shao件:

BOM清dan要qiu某一贴片位hao需要贴片元件却wei贴装元件duo件:BOM清dan要qiu某一贴片位hao不需要贴片元件却已SMT贴片元件;zai不该you的地fang,出现duo余的零件。

15,损件:任何边yuanbo落xiao于元件总宽(W)huo元件厚度(T)的25%末端顶端金属du层缺失最大为50%(各末端)任何暴lu点击的裂缝huo缺口;玻璃元件ti里的裂缝、刻痕huo任何损伤。

任何电阻材质的缺口。任何裂缝huo压痕。

16,起泡、分层:起泡和分层的地区不超出dutongkong每隔一段时间内部导线间距的25%。起泡和分层的地区超出dutongkong每隔一段时间内部导线间距的25%。起泡和分层的地区减shao导电图形间距至违反最xiao电气间隙。

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