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Release Time:2020-11-09 Edit the author:电zi游戏厅下载 Reading:233

   本文关于SMT贴pianjiagong工艺检验标准,以下是详xi内容:


  一、SMT贴pian锡膏工艺

  1.PCB板上印刷的喷锡的weizhiyu焊盘居中,无ming显的偏移,不可影响SMT元件zhan贴yu上锡效guo。


  2.PCB板上印刷喷锡量适中,不能完整的覆gai焊盘,shao锡、漏刷。


  3.PCB板上印刷喷锡dian成形不liang,印刷喷锡连锡、喷锡成凹凸不平状,喷锡移wei超焊盘三分之一。


  二、SMT贴pian红胶工艺

  1.印刷红胶的weizhi居中,无ming显的偏移,不可以影响zhan贴yu焊锡。


  2.印刷红胶胶量适中,能liang好的zhan贴,无欠胶。


  3.印刷红胶胶dian偏移两焊盘中间,可能造成元件yu焊盘不yi上锡。


  4.印刷红胶量过多,从元件体侧下面渗出的胶的宽du大于元件体宽的二分之一。


  三、SMT贴pian工艺

  1、SMT元器件贴zhuang需整qi、正中,无偏移、歪斜。


  2、SMT元器件贴zhuangweizhi的元器件型号规格应正确,元器件应fan面。元器件贴fan(不允xu元件有区别的xiang对称的两个面互huanweizhi,ru:有丝印标识的面yu无丝印标识的面上下颠倒面),功能无法实现。


  3、有极性要求的贴pian元器件贴zhuang需按正确的极性标示jia工。器件极性贴fan、错误(二极管、三极管、钽质电容)。


  4、多yin脚器件或xianglin元件焊盘应无连锡、桥jieduan路。


  5.多yin脚器件或xianglin元件焊盘上应无残留的锡珠、锡渣。

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